2014 TEEAP sTEm Conference
Registration materials are now available on our website for the 2014 TEEAP STEM Conference! Visit our Conference page by clicking HERE. On this page you can also sign up to offer a Special Interest Session or take part in out annual Tech Showcase. If you are a vendor, please consider signing up for space on our exhibit floor!
Design the Future
In an effort to bring industry-leading 3D design software to Pennsylvania middle schools and high schools, Autodesk, Inc. is offering the Autodesk's Design the Future program.
Autodesk launched the Design the Future program in response to the White House ConnectED initiative to provide secondary schools with a wealth of resources to inspire students in science, technology, engineering, digital arts, and math (STEAM) subjects.
Register today to help your school bring next generation resources into the classroom. Your school is eligible to begin with 125 software licenses with three years of access to products that are widely used by leading designers, engineers, and architects, including Autodesk® AutoCAD®, Inventor®, 3ds Max®, Revit®, and Maya®.
Click HERE for more information.
What is STEM you ask?
Pennsylvania Governor's Institute for Engineering & Technology
The Pennsylvania Governor’s School for Engineering and Technology at Lehigh University is a two-week, summer residential program for high school students interested in studying technology and mathematics.
The program, which runs from July 20 to Aug. 2, 2014, will offer students an enrichment experience in science, technology, engineering and math (STEM), cooperative learning, and hands-on laboratory experiences.
To obtain additional information about the Governor’s School for Engineering and Technology and to download an application, visit www.lehigh.edu/pgset.
Students who are selected to attend the Governor’s Schools receive full scholarships, sponsored by the Pennsylvania Department of Education, the universities, and private and corporate donations.
Scholarships cover the costs of housing, meals and all instructional materials. Families are responsible for transportation to and from the university, personal items and spending money. Students must commit to living on campus throughout the duration of the program.
How to Engineer Engineering Education
July 23-25, 2014 @ Bucknell University
For the 13th consecutive year, faculty from Bucknell University are proud to offer this hands on workshop for engineering and science faculty and graduate students to enhance their teaching. APPLY ON-LINE @ http://www.bucknell.edu/Catalyst
Applicants are accepted on a first come, first served basis and will generally be notified of their status shortly after their application is received.
Communication is Key!
Please use the link below to update your contact information with us. In order to further improve our ability to communicate with you regarding information related to this association and the profession, we need to have multiple means of contacting our members. To that end we are working to update our contact records to include both a home and work email. Thanks for helping us out!
What are Students
[engineering design] Thinking?
Click here to download and view the Thursday's keynote speaker's presentation from the 2013 TEEAP sTEm Conference!
Pennsylvania is a member state of the ITEEA's STEM Center for Teaching & Learning Consortium through partnership with California Univ. of PA, Millersville Univ., PA Dept. of Environmental Protection, the TEEAP and the Delaware Valley Industrial Resource Center (DVIRC). Schools across PA have free access to Engineering byDesign™ products. If you are interested in accessing it you need to accept the Licensing & Distribution Agreement and fill out the web form by clicking here. Once your request is received the URL to the PA page will be sent to you.
Thank you to everyone who attended the 2013 TEEAP Conference! We encourage you to consider presenting at next year's conference on November 7th & 8th, 2013. Visit our Conference page for some information concerning the 2013 Conference as well as the form to sign up to present at next year's conference. Information for the 2014 Conference will be available during July of 2014.
The theme ITEEA's 77th Annual Conference is Building Technology and Engineering STEM Partnerships. Science, Technology, Engineering, and Mathematics (sTEm) is very much a “buzzword” on today’s educational landscape. Every teacher, school, district, and state has its own version of what sTEm means as well as how to help students engage in experiences that will prepare them for the 21st Century. Technology and Engineering is the foundation for making these experiences meaningful through integrative sTEm education. sTEm implementation embodies the spirit of partnerships—working collaboratively to reach common goals.
This conference is an opportunity to recognize and honor the accomplishments of our colleagues and best-practice programs. Additionally, it provides professional development and networking opportunities, as well as opportunity to renew old friendships and create new friendships. For more information, click here.